Shenzhen Sky-Win Technology Co., Ltd
Sky-win supply turnkey PCB assembly services, as PCB design, PCB fabrication, components procurement, SMT and DIP assembly, and testing, etc.
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4 Layers SMT PCB Assembly PCBA Prototype Internet Of Things Black Soldmask With Board Thickness 1.0mm
Description of process for SMT PCB Assembly
SMT PCB assembly procedures usually include solder paste printing, chip installation, reflow soldering, AOl, X-ray and rework. A visual inspection is performed after each step of the program.
SMT PCB Basic Process Components
Silk Screen
Testing
Placement
Reflow soldering,
Cleaning
Testing
Repair
SMT PCB Assembly Specification
| SMT Project name Item | SUB P5 PCBA |
| Manufacturing process | SMT, AOI test,X-RAY irradiation analysis,CNC panel |
| Material accuracy | 0402+CO2 sensor |
| Number of materials | 43 kinds |
| Material consumption | 109 pcs |
| PCB process | Immersion Glod |
| Number of PCB layers | 4 layers |
| PCB Surface | Double-Sided Boards |
| Material | FR-4 |
| Board thickness | 1.0 mm |
| Manufacturing quality system | IATF16949 |
| PCB quality system | ROHS/UL |
| Application Field | Air detector, temperature and humidity meter, Internet of Things |
SMT PCB Assembly Manufacturer
Shenzhen SKY-WIN Technology Co., Ltd was founded in February 2015, focusing on PCBA OEM/ODM one-stop service, solution customization, SMT patch, DIP plug-in, functional testing, assembly and other OEM/ODM services.
SMT PCB Assembly Inspection Necessity
In order to ensure the quality and performance of the assembled PCB, it is very necessary to check during the entire SMT assembly process. Multiple types of inspections must be used to reveal manufacturing defects, which can reduce the reliability of the final product.
Visual inspection is most commonly used in SMT patch assembly. As a direct inspection method, visual inspection can be used to indicate obvious physical errors, such as component displacement, missing components, or component irregularity.
Visual inspection is not suitable for visual inspection. Tools such as a magnifying glass or microscope can also be used. In order to further point out the defects occurring in the welding ball, AOI and X-ray inspection can be used after the completion of coal bonding
SMT PCB Assembly Case
